Lockheed Martin Microelectronics Operator / Electronics - Soldering - 2nd shift in Orlando, Florida
1.) Works under direction and from production schedules, manufacturing procedures, process plans and written instruction.
2.) Perform a variety of routine tests on production runs of microelectronics parts using test fixtures, and sorts product using various instruments. Test equipment utilized is manual, semi-automatic and automatic or probe-set bench set up.
3.) Operates and adjusts semi conductor die bond machine to bond die into packages per micro-circuit layout drawing. Requires careful handling for proper placement and alignment of dies. Requires the use of microscope and micro manipulators for precise control of die placement.
4.) Test silicon wafers using semi-automatic wafer probe apparatus, aligns wafers in apparatus, monitors equipment operation.
5.) Loads and unloads components into burn in sockets and further loads those sockets into burn in ovens. Loads and unloads test units in test computers, test fixtures and automatic handlers
6.) Operates and adjusts wire bond apparatus to bond fine wires from components to pads of substrate, from substrate to package leads, or from die directly to package leads. Involves working to microcircuit layout drawings; incumbent is responsible for proper wire dress, bond appearance and bond strength; and apparatus used includes microscope and micro-manipulators for precise movement and control.
7.) Sets up and operates manual, semi-automatic and automatic equipment such as package sealers, screen printers, wire bonders, laser trimmers and other similar microelectronics fabrication. Loads, monitors operation and unloads components from ovens, cleaning stations and marking machines.
8.) Checks product being fabricated/assembled for conformance to specifications and standard. Uses microscopes, leak detectors and other similar equipment which may require adjustment and involve a series of numerical and dial readouts and some interpretation.
9.) Performs specified rework involving removal and replacement of components, removal and repair of wires and/or wire boards.
10.) Flexibility to be trained in multiple Microelectronics processes including those that require use of chemicals.
11.) Visual acuity required to 20/20 correctable with a microscope, high level of manual dexterity, ability to lift 10 pounds minimum, basic computer skills. Reads and interprets engineering drawings.
12.) Significant attention to detail for production activities and documentation to maintain compliance with Mil. Standard requirements.
Must have the ability to work 1st, 2nd, or 3rd shift according to the collective bargaining agreement.
Basic Qualifications Ability to set-up, operate, and adjust microelectronic production equipment. Ability to read and follow process plans and work in a team environment. Ability to obtain solder certification. Must have the ability to work 1st, 2nd, or 3rd shift according to the collective bargaining agreement.
Desired skills Experience setting up, operating and adjusting a variety of microelectronics production equipment used to perform required operations and test on production runs of microelectronic devices/wafers. Experience setting up and operating semi-automatic and automatic equipment.
As a leading technology innovation company, Lockheed Martin’s team of 113,000 people works with partners around the world to bring proven performance to our customers’ toughest challenges. Lockheed Martin has employees based in all 50 states and more than 570 facilities that span 70 countries.
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Lockheed Martin is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, age, protected veteran status, or disability status.
Job Location(s): Orlando Florida